Slightly OT to the discussion. I worked in the PCB industry for over 17 years in machine maintenance and process line install and found that designs for multiple board manufacture varied a lot over the years from simple two sided 'punch and crunch' with routing and perforated break lines to individual 24 layer boards with complex routing profiles. The advent of the cellular phone industry was where V-scoring came into its own on a scale never seen before with large multi-unit main boards with routing and V scoring to divide into smaller sub-boards containing up to 8 units per section that were broken off after population.
There was a small company I used to service who, with limited financial resources, would create large boards with multiple sized rectangular circuits bound for different customers separated them by V scoring and after final test, split them into the different orders. This was a waste reduction exercise for them and proved successful in its operation. -- You received this message because you are subscribed to the Google Groups "neonixie-l" group. To unsubscribe from this group and stop receiving emails from it, send an email to [email protected]. To post to this group, send an email to [email protected]. To view this discussion on the web, visit https://groups.google.com/d/msgid/neonixie-l/ec4dff0f-bbeb-4139-b744-6dc2271cdd78%40googlegroups.com. For more options, visit https://groups.google.com/d/optout.
