Ok, let me define some terms do we don't get confused:

Length is a measurement in the direction perpendicular to the face-plate.

Width is a measurement in the direction perpendicular to the PCI edge
connector (parallel to the traces on the connector).

What I'm going to call "thickness" is what PCI called "component
height", which is a measurement in the direction perpendicular to the
plane of the PCB.

If I'm reading this right, the maximum Width of a PCI board is
106.68mm.  Subtract something like 12mm for the card edge connector
and maybe some tolerance for the top and bottom edges.  Just as a
rough guess, based on some of these other diagrams, I wouldn't go
longer than about 90mm.

The Length shouldn't be smaller than the dimention of the 3S4000, but
it can be bigger due to some dead space for routing.  This should be
somewhere between 2.5 and 3 inches (like 70 to 75 mm).

Maximum component height off the top of the board is 0.57 inches
(14.48mm).  This means that the thickness of the heat sink needs to be
something on the order 0.57 inches, minus the thickness of the two
FPGAs.  The two FPGAs need to be looked up, and if their thicknesses
are different, we need to know, and that will dictate the heat sink
thickness.

If the manufacturer has a list of different sizes that fall about
where we need them, that'll let us defer the final choice for later
while still picking a supplier.


On 9/8/05, Martin Jeppesen <[EMAIL PROTECTED]> wrote:
> 
> > (3) We need a heat sink
> > 
> 
>  I won't mind digging such up. Do you have many measurements?
>  
>  Do you know of retailers that would be worth checking out?
>  
>  
>

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