Do we absolutely need to engineer this thing ourselves?

There's a wealth of after-market GPU coolers, some of which are quite
affordable, and It'd be a nice advantage to have a semi-standard
mounting system (does such a thing exist for GPUs?) to facilitate the
interchange of heatsinks (for instance to allow someone to purchase an
extra-large passive cooler, or an all-out water-cooled heatpipe
unit...  different people have different needs ;)

Here are some examples that touch on some of the spectrum:
http://plycon.com/chipset/chipset.htm

Just a thought.

--tim

On 9/9/05, Timothy Miller <[EMAIL PROTECTED]> wrote:
> On 9/9/05, Jack Carroll <[EMAIL PROTECTED]> wrote:
> 
> >
> >         Dunno what to tell you.  We could probably figure out something, and
> > bench-test it to prove that it cools the chips.  If we were to put a
> > centrifugal blower outside the cramped area, and use flat ductwork to carry
> > the air to the heat sink, it would probably have to be some kind of
> > cut-to-fit ductwork that could be easily configured in the field to fit
> > where it has to go.  Another possibility might be a heat sink with cooling
> > pins instead of fins, and increase its area to get the volume up even with
> > limited thickness.  That might work with natural convection flow in any
> > direction, if the total heat load isn't too large.  There still has to be a
> > way for air to get in and out of the area, though, or nothing will work.
> > I've done some of this kind of design, but only in well-understood
> > industrial situations.  I'm no expert on forced-air cooling, and I don't
> > know the component suppliers for blowers that can run from motherboard fan
> > headers.  Maybe Aavid or Wakefield Engineering has some application notes or
> > tutorials that could educate us.  I can at least look.
> >         If this threatens to become a big deal, we might want to mount an
> > analog temperature IC on the heat sink, so the developer can tell what's
> > really happening.  There are some that can be read out with a common
> > hand-held voltmeter.  I could look in a couple of catalogs if you want me
> > to.
> >         I'm so thankful I picked the builder of my big dual Athlon machine
> > for their expertise in airflow.
> >         I guess the thing that has to be done fairly soon, before parts
> > placement can get under way, is decide the space envelope allocated to the
> > on-board heat sink, and the method of attachment and conductive heat
> > transfer.  Screw holes may have to be placed in the board for heat sink
> > mounting, and their sizes, locations, and keep-out zones must be included in
> > the dimension drawing at start of design.  Don't forget to analyze the
> > tolerance stack-ups around the holes, and make the keep-out zones large
> > enough to contain screw heads, lock washers, and spacers at maximum
> > misalignment plus .015" clearance to the nearest live copper.  I always
> > connect mounting hole pads to the ground plane.
> 
> I'll talk to Howard further on this.  Tech Source has used some
> centrifugal fans on their longer medical cards, but for OGD, we would
> like to have a shorter card, if possible.
> 
> Let's focus on passive cooling for the moment.
> 
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