Palm is replacing cracked cases on the IIIc for free right now. This isn't helping
the poor selling rate of the IIIc at all.
The problem comes from the actual injection mold design. Seems that the design of the
case was extended from the existing Palm III
CAD file. However, there wasn't enough anticipation of the extra twisting done due to
the elongation. The extension of the design
didn't have the extra millimeter of back case thickness needed to take this additional
shearing as it should have. I understand
there is a design change in progress but I have no data if it is complete.
You can compare old cases with the new replacement cases from the date stamping on the
case. I believe it is that little clock
embossment in the inside that tells you the date of manufacture of the case.
Steve
Stuart Uleman wrote:
> Took my 3c out this morning to find that the case is cracked - again.
> I've got a big crack in the rear of the case, about where the battery
> is.
>
> Am I doing something wrong by carrying the 3c around wherever I go???
>
> Ordinarily, I wouldn't post a gripe like this on the Dev forum, but
> this is the third Palm 3c in a row that's cracked on me - is anybody
> else having similar problems with the casing?
>
> =====================================================
> Stuart Uleman [EMAIL PROTECTED]
> http://hanachan.org/
> =====================================================
>
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