Just called Palm and sent the unit in for replacement. The Palm support
folk here in Japan are really polite, and I have nothing but
compliments for the quick support that Palm offers, but it's just soooo frustrating to
have to send in a unit every month <grrrr>
Hoping for better luck with the replacement unit!
=====================================================
Stuart Uleman [EMAIL PROTECTED]
http://hanachan.org/
=====================================================
-----Original Message-----
Date: Wed, 28 Jun 2000 17:52:13 -0700
Subj: Re: Hardware: 3c brittle?
From: Steve Sabram <[EMAIL PROTECTED]>
> The problem comes from the actual injection mold design. Seems that the design of
>the case was extended from the existing Palm III
> CAD file. However, there wasn't enough anticipation of the extra twisting done due
>to the elongation. The extension of the design
> didn't have the extra millimeter of back case thickness needed to take this
>additional shearing as it should have. I understand
> there is a design change in progress but I have no data if it is complete.
--
For information on using the Palm Developer Forums, or to unsubscribe, please see
http://www.palmos.com/dev/tech/support/forums/
