>Does anyone know if the head sink from one of the
>original Apple processor cards can be used with the carrier and ZIF
>processor?

Each ZIF carrier is supplied with its own "purpose built" heat sink. And, 
usuall, a "donut", too.

The design of the heat sink is intimately related to the specific zero 
insertion force socket which the ZIF carrier manufacturer elected to use.

I have seen everything from thin, flat metal plates to robust finned 
devices.

The original Apple heat sink was designed for the 601 only.

The second generation Apple heat sink was designed for the 604 only.

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