On 27 Mar 2006 at 14:56, Leon Altoff wrote: > Rob, > > From what I have been reading the lead free solder is more brittle than > solder with lead and more likely to suffer failures. One report I read > said that adding zinc to tin/silver/copper alloy solder made the break > jagged instead of clean and enabled the join to continue to function. > It just doesn't sound as reliable to me.
I agree, it's not near as good as a lead based solder mechanically but the solder process isn't so different also surface mount technology places far less mechanical stresses on solder joints of course. Rob Studdert HURSTVILLE AUSTRALIA Tel +61-2-9554-4110 UTC(GMT) +10 Hours [EMAIL PROTECTED] http://members.ozemail.com.au/~distudio/publications/ Pentax user since 1986, PDMLer since 1998
