Adeel,
I believe the issue you have mentioned about soldermask thickness
variation was in regards to the old thick-film soldermask. Previously
thick-film solderemask was not used for SMT assemblies because it's thickness
could keep components lifted off their pads. With most thin-film or liquid
soldermasks this is not an issue because they are not typically thick enough to
cause this problem.
The other comments mentioned so far match with my experience/opinion as
well.
Sincerely,
Brad Velander
Senior PCB Designer
Northern Airborne Technology
1925 Kirschner Rd.,
Kelowna, BC, V1Y 4N7.
tel (250) 763-2329 ext. 225
fax (250) 762-3374
>
>-----Original Message-----
>From: Adeel Malik [mailto:[EMAIL PROTECTED]
>Sent: Monday, January 10, 2005 5:06 AM
>To: [email protected]
>Subject: [PEDA] Tenting Phenomenon (Is it riskless)
>
>Hi All,
> I intend to tent vias under components to prevent them
>from shorting the component body. But I have been told that "Solder mask
>thickness can vary enough to cause issues. Also tenting could mean that
>debris in a via hole remains unremoved, and unremovable.".
>Can someone comment on this whether tenting is safe or not.
>If not, can I use silk screen layer to cover the exposed vias ?>
>
>Regards,
>Adeel Malik
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