snip
(It seems I've seen a much thicker dry film on some boards we got several years ago, that must have been close to .020" thick. I don't know what that was, however.
That must have been part of a process called SIPAD, invented by Siemens to confine the solder and prevent bridges on fine-pitch components...
Do a Google search on SIPAD and get more information on it than you probably can muster..;)
Leo Potjewijd hardware designer Integrated Engineering B.V.
[EMAIL PROTECTED] +31 20 4620700
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