Geee,
I haven't heard of this issue for a good number of years (approx
10years?). I thought that dry film soldermask was virtually removed from the
market place because of this particular issue with low geometry SMT components.
I had heard of this many years ago and had figured one of two things happened,
they made thinner dry film masks or they just stopped using it for everyday PCB
designs. At the time the solution was to specify the use of LPI mask or specify
that dry film soldermask was not allowed.
Can anybody bring any other details to the discussion? I thought it was
a non-issue these days, does anybody else see this from their fab shops? Does
anybody know if dry mask is still commonly available or is this particular
fabricator just hanging onto old technology/techniques?
Sincerely,
Brad Velander
Senior PCB Designer
Northern Airborne Technology
1925 Kirschner Rd.,
Kelowna, BC, V1Y 4N7.
tel (250) 763-2329 ext. 225
fax (250) 762-3374
-----Original Message-----
From: Leo Potjewijd [mailto:[EMAIL PROTECTED]
Sent: Tuesday, March 08, 2005 1:26 PM
To: Protel EDA Discussion List
Subject: Re: [PEDA] Solder Mask and FPGAs.
At 08/03/05 20:52, Jon Elson wrote:
>snip
>(It seems I've seen a much thicker dry film on some boards we got several
>years ago, that must have been close to .020" thick. I don't know what
>that was, however.
That must have been part of a process called SIPAD, invented by Siemens to
confine the solder and prevent bridges on fine-pitch components...
Do a Google search on SIPAD and get more information on it than you
probably can muster..;)
Leo Potjewijd
hardware designer
Integrated Engineering B.V.
[EMAIL PROTECTED]
+31 20 4620700
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