Dennis,
No the definition of pattern plating is much sooner in the process.
You'll kick yourself because the name is very literal.
Starting with the electroless laminate, electroless copper plating the
through holes. The next step is your electrolytic plating, this is where
pattern plating comes in. Long ago the most common methodology was simply to
mass plate up the board with X ounces of copper everywhere, then etch off the
copper until you were left with your pattern. The methodology referred to as
pattern plating takes the electroless plated laminate, place a negative pattern
of your circuit for both sides, plate up only the desired trace/pad patterns.
Thus the term pattern plating.
The advantage of pattern plating is that you only have to etch off the
original foil thickness everywhere except where your trace/pad pattern is
remaining. The older methodology had you etching off thicker copper from all
the non-pattern areas. Then also include the issues of undercut for the ticker
copper etching, etc., etc..
Sincerely,
Brad Velander
Senior PCB Designer
Northern Airborne Technology
#14 - 1925 Kirschner Road,
Kelowna, BC, V1Y 4N7.
tel (250) 763-2329 ext. 225
fax (250) 762-3374
-----Original Message-----
From: Dennis Saputelli [mailto:[EMAIL PROTECTED]
Sent: Wednesday, January 18, 2006 1:20 PM
To: Protel EDA Discussion List
Subject: Re: [PEDA] Solder Masks for vias.
can you explain pattern plating ?
i thought it was using the tin/lead plating as etch resist
ds
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