Ivan,
I do designs like this all the time and have had very little trouble
with board warp. I assume that you are talking about FR4 material, total 1
oz. Cu? The controlling issues would be:
1) Do not thermally shock the boards, 'rapid' heat or cool cycle (ie. hot
oil solder reflow during fabrication).
2) Ensure that the boards are well supported and/or held in fixtures during
reflow or wave soldering.
3) Use a slow temperature ramp in your reflow or wave soldering process,
both heating and particularly cooling.
4) On your circuit side you can fill unused areas with copper polygons to
assist in reducing the copper difference between layers.
There is no single golden solution to board warp, rather a lot of
minor issues which can mostly be controlled or minimised to reduce their
effect.
Sincerely,
Brad Velander.
Lead PCB Designer
Norsat International Inc.
Microwave Products
Tel (604) 292-9089 (direct line)
Fax (604) 292-9010
email: [EMAIL PROTECTED]
http://www.norsat.com
Visit us at Booth 2G2-09 at CommunicAsia 2002 in Singapore June 18-21.
> -----Original Message-----
> From: Bagotronix Tech Support [mailto:[EMAIL PROTECTED]]
> Sent: Tuesday, May 14, 2002 8:51 AM
> To: Protel EDA Forum
> Subject: [PEDA] board warp question
>
>
> Hello, all:
>
> I have a double sided PCB about 4 x 4 in. square, supported
> by mounting
> holes, 1 in each corner. I want to pour a polygon ground
> plane on the top
> side. The plane will cover probably about 80% of the board
> area. There
> will be no plane on the bottom side. Am I going to have a
> problem with
> board warp with this?
>
> Thanks to those who responded to my "round board" questions.
>
> Best regards,
> Ivan Baggett
> Bagotronix Inc.
> website: www.bagotronix.com
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