The recent thread on masking layers have given rise to some other issues. There are usually 3 types of Solder Mask available from the PCB manufacturers, namely, LPI, Dry Film and Wet. LPI is mostly suited to track widths in the range of 5-8mils but is less thicker then dry film. Dry film is more thick but at the same time more expensive. Can someone comment on the reliability issues of these different Solder Mask types and in which application one should be preferred on another ?.
My second question is regarding various surface finishes using Gold. Usually the manufacturers support following types of surface-finish with Gold. 1. Panel Gold Plating (Flash Gold) 2. Electroless Nickel Immersion Gold 3. Normal Gold Finger Plating (usually carried out for PCI cards) Can someone comment on the advantages and disadvantages of these different types of plating ?. regards, ADEEL MALIK, PAKISTAN * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
