I am also interested in this. What are the differences between LPI and wet?
We have had problems with soldermask getting thin on the sharp hole edge of vias, allowing corrosion of the un-plated copper beneath. Another indication of this thinness is some of the holes being filled during wave soldering. Are some techniques more resistant to these effects than others? -----Original Message----- From: Adeel Malik [mailto:[EMAIL PROTECTED]] Sent: Friday, May 17, 2002 6:26 AM To: Protel EDA Forum Subject: [PEDA] Queries about the prevailing Solder Masking Techniques The recent thread on masking layers have given rise to some other issues. There are usually 3 types of Solder Mask available from the PCB manufacturers, namely, LPI, Dry Film and Wet. LPI is mostly suited to track widths in the range of 5-8mils but is less thicker then dry film. Dry film is more thick but at the same time more expensive. Can someone comment on the reliability issues of these different Solder Mask types and in which application one should be preferred on another ?. My second question is regarding various surface finishes using Gold. Usually the manufacturers support following types of surface-finish with Gold. 1. Panel Gold Plating (Flash Gold) 2. Electroless Nickel Immersion Gold 3. Normal Gold Finger Plating (usually carried out for PCI cards) Can someone comment on the advantages and disadvantages of these different types of plating ?. regards, ADEEL MALIK, PAKISTAN * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/proteledaforum@techservinc.com * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
