I have a design question for us to chew at a bit. I have a 4-layer board top side components only. The inner layers are spit-mixed power and ground plane, not necessarily in that order though. The bottom side of the board is almost bare with only a few traces on it. My question, from anyones experience, is there a problem with bare board mfg or the assembly mfg with this due to a imbalance in copper distribution or anything? I want to keep it just like it is. I have isolation transformer and 3 power supplies on this relatively small board. The only reason I ask is because I can pour bottom side copper for more ground copper distribution at isolated destinations, but it really isn't necessary unless its a mfg problem. Hammer me head! Thanks, Michael Biggs
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
