[At the risk of sounding like a commercial...]
Try this link Ray, and see if what they are doing will help.
A good friend of mine, Tom Hausherr, has been working on a common industry
library with the IPC and has come out with a product that they think will
help standardize the industry from design through assembly.
(And no I'm not getting paid to say that... lol) Check it out. It will
replace the IPC-SM-782 spec on surface mount components.
I'll copy the release below for your reference...
PCB Design Engineer , C.I.D., C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
For Immediate Release
IPC Releases IPC-7351 Library Generation
Tools for CAD Land Pattern Design
NORTHBROOK, Ill., March 4, 2004 - IPC - Association Connecting Electronics
Industries, in conjunction with the International Electrotechnical
Commission (IEC) and world electronics industry standard groups, have
released library generation tools in support of the forthcoming IPC-7351,
Generic Requirements for Surface Mount Design and Land Pattern Standard, for
CAD land pattern.
Consisting of a powerful array of calculator and viewer tools developed
between IPC and PCB Libraries, the IPC-7351 library generation tool set
introduces the following for CAD libraries:
1. An intelligent land pattern naming convention, which will aid in the
standardization of electronic schematic symbols for engineering.
2. Zero component rotations to allow CAD land patterns to be built with
the same rotation for the purpose of assembly machine automation.
3. Three new application-specific land pattern geometry variations that
support various levels of product complexity. This 3-Tier CAD library
system will support the following variations for each device family:
a. Least Environment Land Pattern for miniature devices where the land
pattern has the least amount of solder pattern to achieve the highest
component packing density.
b. Nominal Environment Land Pattern for products with a moderate level
of component density and providing a more robust solder attachment.
c. Most Environment Land Pattern for high component density
applications typical of portable/hand-held products and products exposed to
high shock or vibration. The solder pattern is the most robust and can be
easily reworked if necessary.
4. A placement courtyard excess that has been redefined to accommodate
the three land pattern geometry variations.
5. Clear definitions for silkscreen and polarity marking sizes, copper
to ink clearances and locations.
6. Land pattern origins to aid pick and place machine automation.
7. Incorporation of enhanced mathematical algorithms for determining
pad sizes and spacing within the 3-Tier environment. These algorithms
account for fabrication, assembly and component tolerances to calculate a
precise land pattern.
8. New 3D modeling for mechanical verification using maximum component
outlines and maximum component height.
This array of CAD library generation tools complements the IPC-7351 concept
of defining those properties crucial for global standardization and future
acceptance of a "One World CAD Library," whose main objective is to achieve
the highest level of "Electronic Product Development Automation." Developed
in conjunction with PCB Libraries, these tools include browsers for quick
location of land patterns, viewers for accessing component data for parts
within a CAD library and calculators for defining exact land pattern
dimensions from user supplied component and process data through the
application of IPC mathematical algorithms.
"It's no surprise that many large firms spend millions of dollars creating
and implementing their own proprietary standards for their own electronic
product development automation, standards not openly shared with the rest of
the industry," noted John Perry, IPC's technical project manager. "These
library generation tools, which support the forthcoming IPC-7351, will aid
in the elimination of massive duplication of effort that costs our industry
millions of unnecessary man hours by introducing a new standard that will
allow electronic firms to benefit from electronic product development
The IPC-7351, like its predecessor IPC-SM-782A, Surface Mount and Land
Pattern Design, will provide the appropriate size, shape and tolerance of
surface mount land patterns, while allowing for inspection, testing and
rework of component solder joints. In addition, the new standard will
provide updated surface mount design rules, addressing the complexity of
land pattern design for increasingly higher density electronics. IPC-7351
is anticipated for release in May 2004.
For more information, visit www.PCBLibraries.com or contact Perry at
[EMAIL PROTECTED] or 847-790-5318.
About PCB Libraries
PCB Libraries is a team of individuals within the printed circuit board
(PCB) industry who seek to eliminate the waste of resources associated with
the creation of CAD libraries. Land pattern calculators furnished by PCB
Libraries in conjunction with IPC have been tested and are currently used by
designers and engineers at companies such as Intel, Honeywell, AGFA,
Panasonic, Sandia National Laboratories, and Coretec. PCB Libraries has
teamed with a number of organizations to help ensure its PCB-based products
are the most accurate and useful available and strive to continuously
enhance and update their products. For more information, visit
IPC is a Northbrook, Ill.-based trade association dedicated to the
competitive excellence and financial success of its more than 2,200 member
companies, which represent all facets of the electronic interconnection
industry, including design, printed circuit board manufacturing and
electronics assembly. As a member-driven organization and leading source
for industry standards, training, market research and public policy
advocacy, IPC supports programs to meet the needs of a $40 billion U.S.
industry employing more than 350,000 people. IPC maintains additional
offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; The
Netherlands; and Shanghai, China. For more information, visit www.ipc.org.
Joe Dudeck, IPC Communications Manager
E: [EMAIL PROTECTED]
From: Ray Mitchell [mailto:[EMAIL PROTECTED]
Sent: Wednesday, March 10, 2004 9:36 AM
To: [EMAIL PROTECTED]
Subject: [PEDA] Common PCB footprint specifications
I'm sure this is a repeat, but is there a simple specification readily
available that gives the "commonly accepted" (if there is such a thing)
dimensions for 0402, 0603, ..., SIOC-14, etc., and all the other "standard"
footprints? I don't really want to wade through a bunch of technical stuff
to derive all of this myself and I certainly don't want to trust a priori
the patterns that come with Protel or any other product. It's really
annoying when part manufacturers don't provide these footprints, assuming
they are common knowledge.
Engineer, Code 2732
SPAWAR Systems Center
San Diego, CA. 92152
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