[At the risk of sounding like a commercial...] Try this link Ray, and see if what they are doing will help.
http://www.pcblibraries.com/ A good friend of mine, Tom Hausherr, has been working on a common industry library with the IPC and has come out with a product that they think will help standardize the industry from design through assembly. (And no I'm not getting paid to say that... lol) Check it out. It will replace the IPC-SM-782 spec on surface mount components. I'll copy the release below for your reference... Bill Brooks PCB Design Engineer , C.I.D., C.I.I. Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510 ---------------------------------------------------------------------- For Immediate Release IPC Releases IPC-7351 Library Generation Tools for CAD Land Pattern Design NORTHBROOK, Ill., March 4, 2004 - IPC - Association Connecting Electronics Industries, in conjunction with the International Electrotechnical Commission (IEC) and world electronics industry standard groups, have released library generation tools in support of the forthcoming IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard, for CAD land pattern. Consisting of a powerful array of calculator and viewer tools developed between IPC and PCB Libraries, the IPC-7351 library generation tool set introduces the following for CAD libraries: 1. An intelligent land pattern naming convention, which will aid in the standardization of electronic schematic symbols for engineering. 2. Zero component rotations to allow CAD land patterns to be built with the same rotation for the purpose of assembly machine automation. 3. Three new application-specific land pattern geometry variations that support various levels of product complexity. This 3-Tier CAD library system will support the following variations for each device family: a. Least Environment Land Pattern for miniature devices where the land pattern has the least amount of solder pattern to achieve the highest component packing density. b. Nominal Environment Land Pattern for products with a moderate level of component density and providing a more robust solder attachment. c. Most Environment Land Pattern for high component density applications typical of portable/hand-held products and products exposed to high shock or vibration. The solder pattern is the most robust and can be easily reworked if necessary. 4. A placement courtyard excess that has been redefined to accommodate the three land pattern geometry variations. 5. Clear definitions for silkscreen and polarity marking sizes, copper to ink clearances and locations. 6. Land pattern origins to aid pick and place machine automation. 7. Incorporation of enhanced mathematical algorithms for determining pad sizes and spacing within the 3-Tier environment. These algorithms account for fabrication, assembly and component tolerances to calculate a precise land pattern. 8. New 3D modeling for mechanical verification using maximum component outlines and maximum component height. This array of CAD library generation tools complements the IPC-7351 concept of defining those properties crucial for global standardization and future acceptance of a "One World CAD Library," whose main objective is to achieve the highest level of "Electronic Product Development Automation." Developed in conjunction with PCB Libraries, these tools include browsers for quick location of land patterns, viewers for accessing component data for parts within a CAD library and calculators for defining exact land pattern dimensions from user supplied component and process data through the application of IPC mathematical algorithms. "It's no surprise that many large firms spend millions of dollars creating and implementing their own proprietary standards for their own electronic product development automation, standards not openly shared with the rest of the industry," noted John Perry, IPC's technical project manager. "These library generation tools, which support the forthcoming IPC-7351, will aid in the elimination of massive duplication of effort that costs our industry millions of unnecessary man hours by introducing a new standard that will allow electronic firms to benefit from electronic product development automation." The IPC-7351, like its predecessor IPC-SM-782A, Surface Mount and Land Pattern Design, will provide the appropriate size, shape and tolerance of surface mount land patterns, while allowing for inspection, testing and rework of component solder joints. In addition, the new standard will provide updated surface mount design rules, addressing the complexity of land pattern design for increasingly higher density electronics. IPC-7351 is anticipated for release in May 2004. For more information, visit www.PCBLibraries.com or contact Perry at [EMAIL PROTECTED] or 847-790-5318. About PCB Libraries PCB Libraries is a team of individuals within the printed circuit board (PCB) industry who seek to eliminate the waste of resources associated with the creation of CAD libraries. Land pattern calculators furnished by PCB Libraries in conjunction with IPC have been tested and are currently used by designers and engineers at companies such as Intel, Honeywell, AGFA, Panasonic, Sandia National Laboratories, and Coretec. PCB Libraries has teamed with a number of organizations to help ensure its PCB-based products are the most accurate and useful available and strive to continuously enhance and update their products. For more information, visit www.PCBLibraries.com. About IPC IPC is a Northbrook, Ill.-based trade association dedicated to the competitive excellence and financial success of its more than 2,200 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $40 billion U.S. industry employing more than 350,000 people. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; The Netherlands; and Shanghai, China. For more information, visit www.ipc.org. Contact Information: Joe Dudeck, IPC Communications Manager P: 847-790-5371 E: [EMAIL PROTECTED] -----Original Message----- From: Ray Mitchell [mailto:[EMAIL PROTECTED] Sent: Wednesday, March 10, 2004 9:36 AM To: [EMAIL PROTECTED] Subject: [PEDA] Common PCB footprint specifications Hello, I'm sure this is a repeat, but is there a simple specification readily available that gives the "commonly accepted" (if there is such a thing) dimensions for 0402, 0603, ..., SIOC-14, etc., and all the other "standard" footprints? I don't really want to wade through a bunch of technical stuff to derive all of this myself and I certainly don't want to trust a priori the patterns that come with Protel or any other product. It's really annoying when part manufacturers don't provide these footprints, assuming they are common knowledge. Thanks, Ray Mitchell Ray Mitchell Engineer, Code 2732 SPAWAR Systems Center San Diego, CA. 92152 (619)553-5344 [EMAIL PROTECTED] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[EMAIL PROTECTED] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
