El vie., 5 oct. 2018 a las 16:04, Michael Olbrich
(<[email protected]>) escribió:
>
> On Fri, Oct 05, 2018 at 12:43:01PM +0200, Guillermo Rodriguez Garcia wrote:
> > > > +# 
> > > > ----------------------------------------------------------------------------
> > > > +# Prepare
> > > > +# 
> > > > ----------------------------------------------------------------------------
> > > > +
> > > > +STM32FLASH_CONF_TOOL := NO
> > > > +STM32FLASH_MAKE_ENV  := $(CROSS_ENV)
> > > > +STM32FLASH_INSTALL_OPT       := PREFIX=/usr install
> > >
> > > For readability, keep these options on a single line each:
> > >
> > > STM32FLASH_INSTALL_OPT       := \
> > >         PREFIX=/usr \
> > >         install
> > >
> > > Also most packages keep *_INSTALL_* variables under the Install section
> > > header, and *_MAKE_* variables under the "Compile" section header. I
> > > would suggest to do it here too to get a unified look over package
> > > rules.
> >
> > Uhm, most of the existing packages I have checked define MAKE_ and
> > INSTALL_ vars in the prepare stage. See for example bzip2 (this is the
> > one I used as a reference), busybox, i2c-tools, openssl, zip ...
>
> I'd put it all in the prepare section if _only_ these variables are
> defined and the other sections are skipped entirely. If the actual compile
> / install target is defined as well, then the variable should be in the
> corresponding section.

Allright. That's exactly the case here, only these variables are defined
and there is nothing else in the compile / install sections. I'll send v2 of
the patch then.

BR,

Guillermo Rodriguez Garcia
[email protected]

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