Hi Susan:
to my products. Is there a general guideline for separating traces to meet
isolation requirements and survive a 2000 VDC (input to chassis) hi-pot
requirement?
There are regs and there are rules of thumb and there are
physics...
...that govern the distance at which
I recall many messages regarding trace separation, etc. to meet certain
voltage isolation requirements; however, none of those specs are applicable
to my products. Is there a general guideline for separating traces to meet
isolation requirements and survive a 2000 VDC (input to chassis) hi-pot
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