Re: Thermal Compound Question

2010-11-04 Thread Tina K.

On 2010/11/04 10:59, Albert Carter so eloquently wrote:

Remove the heat sink remove what you can with a lint free paper towel
and then clean the rest off using a 85% or better isopropyl alcohol.


Seconded. Use isopropyl alcohol, not rubbing alcohol. It's still dirt cheap.

Tina

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Re: Mismatched SCSI connectors... (G4 Sawtooth)

2010-11-04 Thread Peter Haas


On Nov 4, 2010, at 11:05 AM, Bruce Johnson wrote:

No, a lot of SCSI scanners conformed to the Mac DB25 standard. My  
Umax had a DB25 SCSI port on it.


ALL of mine, too ... at least those which were originally intended  
for so-called "non-professional" applications.


For those which were originally intended for so-called "professional"  
applications, ALL have had HD50 (SCSI-2 single-wide) connectors.



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Re: Thermal Compound Question

2010-11-04 Thread Peter Haas


On Nov 4, 2010, at 9:59 AM, Albert Carter wrote:

I wouldn't necessary recommend using Pin-Sol or Water to clean a  
processor.


That's YOU and I'm ME.

Pine-Sol is water soluble, and hot water, as in a rinse, is  
exceptionally easy to remove.






Best method I've found is to run the machine long enough to heat  
up. Remove the heat sink remove what you can with a lint free paper  
towel and then clean the rest off using a 85% or better isopropyl  
alcohol.


NO volatile chemical, such as isopropyl alcohol, or ANY alcohol, for  
that matter, can be truly easier to dispose of as is pure water.





For ME, the "gold standard", for purposes of processor and heat sink  
cleaning and for preparation for newly applied heat sink compound is:


1) Pine-Sol, to completely dissolve the "grease" which is THE major  
component in any such heat sink compounds, followed IMMEDIATELY by


2) hot water, to completely dissolve the Pine-Sol, follower  
IMMEDIATELY by


3) compressed air or gas (I usually use carbon dioxide from a 35  
pound cylinder of the same), to blow-away any remaining water.



With the Pine-Sol method, you would apply it using a Q-Tip, and using  
the minimum Pine-Sol which proved to be necessary to completely  
dissolve the "grease".


You would also apply the minimum water which proved to be necessary  
to completely dissolve the (water-soluble) Pine-Sol.


Finally, you would also apply the minimum CO2 which proved to be  
necessary to completely remove the water.



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Re: Mismatched SCSI connectors... (G4 Sawtooth)

2010-11-04 Thread Bruce Johnson


On Nov 3, 2010, at 7:42 PM, Doug McNutt wrote:


There is something that doesn't make a lot of sense here.

I don't think there ever was a peecee that used a DB25 connector for  
SCSI. Only Apple ever did that and they shorted a bunch of grounds  
together while violating SCSI rules of engagement.


Was that scanner really a peecee parallel-port device?


No, a lot of SCSI scanners conformed to the Mac DB25 standard. My Umax  
had a DB25 SCSI port on it.


--
Bruce Johnson
University of Arizona
College of Pharmacy
Information Technology Group

Institutions do not have opinions, merely customs

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Re: Thermal Compound Question

2010-11-04 Thread Albert Carter
I wouldn't necessary recommend using Pin-Sol or Water to clean a processor. 
Best 
method I've found is to run the machine long enough to heat up. Remove the heat 
sink remove what you can with a lint free paper towel and then clean the rest 
off using a 85% or better isopropyl alcohol.






From: Peter Haas 
To: g3-5-list@googlegroups.com
Sent: Thu, November 4, 2010 12:28:44 PM
Subject: Re: Thermal Compound Question


On Nov 4, 2010, at 8:13 AM, Geke wrote:

> To improve conductance, you can use the type of paste containing metal
> (like Arctic silver), but then you have to be more careful than with
> the white "ceramic" type of paste, because metal also conducts
> electricity.

The white pastes are a nuisance to clean-up after.

However, these clean-up quite easily by using full-strength Pine-Sol, followed 
by a hot water rinse.

Arctic silver is indeed conductive, which is why the applications procedure is 
so involved.

White and diamond pastes are non-conductive, and the procedures are somewhat 
simpler.



  

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Re: Thermal Compound Question

2010-11-04 Thread Peter Haas


On Nov 4, 2010, at 8:13 AM, Geke wrote:


To improve conductance, you can use the type of paste containing metal
(like Arctic silver), but then you have to be more careful than with
the white "ceramic" type of paste, because metal also conducts
electricity.


The white pastes are a nuisance to clean-up after.

However, these clean-up quite easily by using full-strength Pine-Sol,  
followed by a hot water rinse.


Arctic silver is indeed conductive, which is why the applications  
procedure is so involved.


White and diamond pastes are non-conductive, and the procedures are  
somewhat simpler.



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Re: Thermal Compound Question

2010-11-04 Thread Geke
> thin layer, to fill in any voids on the surface of the chip and heatsink.
>From what I’ve read, that’s the idea. Thermal paste is not a great
heat conductor, but it’s much better than air.
To improve conductance, you can use the type of paste containing metal
(like Arctic silver), but then you have to be more careful than with
the white "ceramic" type of paste, because metal also conducts
electricity.

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Re: Thermal Compound Question

2010-11-04 Thread ah...clem
On Nov 4, 12:16 am, "Tina K."  wrote:
>
> That might not be the case, I do remember some Apple model being
> manufactured with too much thermal paste by mistake, but I don't
> remember which model it was.

that was clearly a manufacturing mistake.  i had a PB G4 1.67 hi-res
model, and the processor burned out.  when i disassembled it, i
discovered that there were gobs and gobs of the thermal paste.  WAY
too much, and that undoubtedly contributed to the failure.  i scraped
chunks off the heatsink and when i replaced the mobo i used the proper
amount, and it is still going strong.

rule of thumb, however little you apply, it is too much.  there isn't
ANYTHING that is better than direct contact.  the thermal paste is
only to fill the microscopic voids between the two surfaces in direct
contact.  cover the entire surface with paste (don't get any over the
edges), then scrape off as much as you can, press together firmly and
then pull it apart, it should appear that there are large areas with
no paste at all.  this is the correct amount.

i don't recall the brand name, but when i used to build high power
solid-state amplifiers where the massive output transistors generated
much more heat than a CPU, we used a white silicone grease.  as
another reader suggested, i would avoid any paste containing metallic
powder, or powdered diamonds, either.  the mere presence of solid
particles in the paste means that it will likely be applied thicker
than it should be.


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Re: Thermal Compound Question

2010-11-04 Thread george monroe
http://benchmarkreviews.com/index.php?option=com_content&task=view&id=150&Itemid=62&limit=1&limitstart=0

On Thu, Nov 4, 2010 at 8:30 AM, george monroe  wrote:

> http://skinneelabs.com/tim-v2.html
>
>
> On Thu, Nov 4, 2010 at 7:59 AM, george monroe wrote:
>
>> from what i have read, it seems most compounds are close to each other in
>> abilities. the thing i noticed was the different schools of thought on the
>> amount to use. i personally am sticking with the thought that the paste is
>> to fill in any voids on the surface of the chip and heatsink, i dont put a
>> thick layer on. i am also pretty confident that as long as we only use a
>> small amount, the idea of seepage, is that a word, will not be a problem and
>> if a minute amount seeps off the surface of the chip it will not cause
>> damage. i also avoid any metalic containing paste just to be sure.
>>
>>
>> On Thu, Nov 4, 2010 at 12:16 AM, Tina K.  wrote:
>>
>>> On 2010/11/03 12:39, John Carmonne so eloquently wrote:
>>>

 I have noticed that Apple used a thick paste on the G4 PowerBooks, I
 assume this is because the possible flexing and ambient temperature
 changes of the components could break the thermal contact

>>>
>>> That might not be the case, I do remember some Apple model being
>>> manufactured with too much thermal paste by mistake, but I don't remember
>>> which model it was.
>>>
>>>
>>> Tina
>>>
>>> --
>>>
>>> iMac 20" USB 2 1.25GHz G4 2GB RAM GeForce FX 5200 Ultra 64MB DDR
>>> Gnome/Ubuntu 10.10
>>>
>>> Power Mac June 04 2GHz G5DP 8GB RAM GeForce 6800 Ultra DDL 256MB Leopard
>>> 10.5.8
>>>
>>> PowerBook G4 15" HiRes DLSD 1.67GHz G4 2GB RAM Radeon 9700 128MB DDR
>>> Leopard 10.5.8
>>>
>>> --
>>>  You received this message because you are a member of G-Group, a group
>>> for those using G3, G4, and G5 desktop Macs - with a particular focus on
>>> Power Macs.
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>>> netiquette guide is at http://www.lowendmac.com/lists/netiquette.shtml
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>>>
>>
>>
>

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Re: Anti-virus for Mac

2010-11-04 Thread Yersinia

 On 11/3/10 11:36 PM, Bruce Johnson wrote:


On Nov 3, 2010, at 7:10 PM, Yersinia wrote:



OK, thanks for the heads-up about a first time virus scan being like 
Spotlight/taking forever. Maybe I will try Sophos after all. But... 
what IS "Access scanning" and what do you mean by "files are only 
ever scanned if the system touches thsm"?  By "the system" do you 
mean OS X?



on access scanning means that when files are read (for the first time 
in a session) or written they're scanned. It's sort of like spotlight 
which only indexes when files are changed.


Both programs insert themselves into the OS so that when files are 
read or written; they scan the file before the OS can do anything.
Oh wow, OK! But that sounds a lot like lysogeny to me! LOL! ( is there a 
microbiologist in the house?  ;-) )


If this sounds a lot like what malware would do, you're right.  Some 
years back a Sophos update decided that a bunch of Microsoft 
application support files were viruses.  A LOT of folks suddenly ended 
up with fubared Office installs, and a lot of IT folks cursed Sophos 
that day.


ROFLMAO! ...uh-HUH, definitely seeing this lysogenic virus incorporating 
its genome into the genome of the host cell so that ITS proteins will 
code instead of those of the host cell's


...and yeah, I know I shouldn't be laughing on account of all the 
trouble and aggravation those poor IT folks had to deal with on account 
of it, but just the IDEA that any version of a Mac AV application would 
have decided that ANYTHING MicroBorg on the systems were viruses just 
tickles my funnybone!  . . .


Anyway, I ran Sophos on my Quicksilver last night and no threats were 
found -- at least not on the big 60 GB HDD. There's also a 30 GB HDD in 
this machine, and I was just trying to figure out how to tell if THAT 
drive was checked too (the "help" isn't really all that great, but 
Google is my friend and they do have a forum I noticed). Once I'm sure 
of that, think I'll also run it on the Mini and iBook since they aren't 
Internet virgins either -- the iBook in particular but on rare 
occasions, I actually have taken the Mini online.


Thanks for the help, and the laugh.

~Yersinia.

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Re: Thermal Compound Question

2010-11-04 Thread george monroe
http://skinneelabs.com/tim-v2.html

On Thu, Nov 4, 2010 at 7:59 AM, george monroe  wrote:

> from what i have read, it seems most compounds are close to each other in
> abilities. the thing i noticed was the different schools of thought on the
> amount to use. i personally am sticking with the thought that the paste is
> to fill in any voids on the surface of the chip and heatsink, i dont put a
> thick layer on. i am also pretty confident that as long as we only use a
> small amount, the idea of seepage, is that a word, will not be a problem and
> if a minute amount seeps off the surface of the chip it will not cause
> damage. i also avoid any metalic containing paste just to be sure.
>
>
> On Thu, Nov 4, 2010 at 12:16 AM, Tina K.  wrote:
>
>> On 2010/11/03 12:39, John Carmonne so eloquently wrote:
>>
>>>
>>> I have noticed that Apple used a thick paste on the G4 PowerBooks, I
>>> assume this is because the possible flexing and ambient temperature
>>> changes of the components could break the thermal contact
>>>
>>
>> That might not be the case, I do remember some Apple model being
>> manufactured with too much thermal paste by mistake, but I don't remember
>> which model it was.
>>
>>
>> Tina
>>
>> --
>>
>> iMac 20" USB 2 1.25GHz G4 2GB RAM GeForce FX 5200 Ultra 64MB DDR
>> Gnome/Ubuntu 10.10
>>
>> Power Mac June 04 2GHz G5DP 8GB RAM GeForce 6800 Ultra DDL 256MB Leopard
>> 10.5.8
>>
>> PowerBook G4 15" HiRes DLSD 1.67GHz G4 2GB RAM Radeon 9700 128MB DDR
>> Leopard 10.5.8
>>
>> --
>>  You received this message because you are a member of G-Group, a group
>> for those using G3, G4, and G5 desktop Macs - with a particular focus on
>> Power Macs.
>> The list FAQ is at http://lowendmac.com/lists/g-list.shtml and our
>> netiquette guide is at http://www.lowendmac.com/lists/netiquette.shtml
>> To post to this group, send email to g3-5-list@googlegroups.com
>> For more options, visit this group at
>> http://groups.google.com/group/g3-5-list
>>
>
>

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Re: Thermal Compound Question

2010-11-04 Thread george monroe
from what i have read, it seems most compounds are close to each other in
abilities. the thing i noticed was the different schools of thought on the
amount to use. i personally am sticking with the thought that the paste is
to fill in any voids on the surface of the chip and heatsink, i dont put a
thick layer on. i am also pretty confident that as long as we only use a
small amount, the idea of seepage, is that a word, will not be a problem and
if a minute amount seeps off the surface of the chip it will not cause
damage. i also avoid any metalic containing paste just to be sure.

On Thu, Nov 4, 2010 at 12:16 AM, Tina K.  wrote:

> On 2010/11/03 12:39, John Carmonne so eloquently wrote:
>
>>
>> I have noticed that Apple used a thick paste on the G4 PowerBooks, I
>> assume this is because the possible flexing and ambient temperature
>> changes of the components could break the thermal contact
>>
>
> That might not be the case, I do remember some Apple model being
> manufactured with too much thermal paste by mistake, but I don't remember
> which model it was.
>
>
> Tina
>
> --
>
> iMac 20" USB 2 1.25GHz G4 2GB RAM GeForce FX 5200 Ultra 64MB DDR
> Gnome/Ubuntu 10.10
>
> Power Mac June 04 2GHz G5DP 8GB RAM GeForce 6800 Ultra DDL 256MB Leopard
> 10.5.8
>
> PowerBook G4 15" HiRes DLSD 1.67GHz G4 2GB RAM Radeon 9700 128MB DDR
> Leopard 10.5.8
>
> --
>  You received this message because you are a member of G-Group, a group
> for those using G3, G4, and G5 desktop Macs - with a particular focus on
> Power Macs.
> The list FAQ is at http://lowendmac.com/lists/g-list.shtml and our
> netiquette guide is at http://www.lowendmac.com/lists/netiquette.shtml
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> http://groups.google.com/group/g3-5-list
>

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