Judging from "datasheet" provided, it is really the same die as in old
chips. It makes me wonder if these weren't created from leftover dies from
old production, just packaged in different housing.
Note that all the bad things about old chips are present here too:
breakdown voltage of >60V, high
Seriously? SOIC version of K1551D1?
Why? I really do not see any need for it.
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The art of combining the metal legs and the tube is owned by the master
glass blower. Because it's the art of working with glass. :-)
пятница, 9 марта 2018 г., 23:33:20 UTC+3 пользователь Paul Andrews написал:
>
> Looks like vacuumglow is aiming to refill tubes:
>
> https://www.facebook.com/vacu
*I have a few questions about these ic’s that I hope you can answer: *
*Which company is manufacturing these ic’s?*
My company
Details
LLC "R&D Production Center Microbiotechniques"
ITN (Individual Taxpayer Number): 4004019698
IEC (Industrial Enterprises Classifier): 400401001
PSRN (Primary S
So the die wafers were produced recently, in last year or this year?
/Martin
On Tuesday, 10 April 2018 13:06:26 UTC+2, Dmitry Shevchenko wrote:
>
> *I have a few questions about these ic’s that I hope you can answer: *
> *Which company is manufacturing these ic’s?*
>
> My company
> Details
>
>
4" wafer produced at begin 2017.
Wafer has been diced (scribed) and assembled at December 2017.
понедельник, 9 апреля 2018 г., 10:20:05 UTC+3 пользователь Dmitry
Shevchenko написал:
>
> Hello, my friend.
> I'm a Dmitry Shevchenko, former engineer ( rus direct translation - the
> engineer-technol
Wow! 4-inch wafers. I have not seen one of those since the 1980's.
What process-technology is this on ?
I'd love to hear more about the number of number of masks, and process
steps.
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>While we are at it, I have this question to ask:
Why on earth would a surface mount version of a K1551D1
even be a consideration, much less a real product?
>
>
> Original Message
>From: gregeb...@hotmail.com
>To: neonixie-l@googlegroups.com
>Subject: RE: [neonixie-l] Re: Russians chip K
I'm speculating that most packaging houses only offer SMT-style packages.
They are produced by the billions and have lower material costs than DIP
due to smaller size alone. On top of that, leadframes for DIPs are probably
in much shorter supply.
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yep. cheap. cheap. cheap.
Original Message
From: gregeb...@hotmail.com
To: neonixie-l@googlegroups.com
Subject: Re: [neonixie-l] Re: Russians chip K155ID1 SOIC 16L
packaged
Date: Tue, 10 Apr 2018 13:12:44 -0700 (PDT)
>I'm speculating that most packaging houses only offer SMT-style
>
Can you show any photos of the new chip, not only the whole wafer but the
also a single chip in good resolution?
What factory made the wafers and the chips and what factory put them in the
SOIC capsules?
/Martin
On Tuesday, 10 April 2018 19:38:38 UTC+2, Dmitry Shevchenko wrote:
>
> 4" wafer pr
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