If I am not wrong someone here on the forum said that they had removed the
case from the LM9022 to have a peek at the chip inside (could have been
many years ago this was done). I wonder if someone has made the same trick
with these new chips?
/Martin
@Dmitry: A photo of the actual chip used w
Direct link https://www.ebay.com/usr/microbiotechnique
48pc sold
2256 available
понедельник, 9 апреля 2018 г., 10:20:05 UTC+3 пользователь Dmitry
Shevchenko написал:
>
> Hello, my friend.
> I'm a Dmitry Shevchenko, former engineer ( rus direct translation - the
> engineer-technologist of electr
The return policy added on ebay listing.
30-day return of chip.
понедельник, 9 апреля 2018 г., 10:20:05 UTC+3 пользователь Dmitry
Shevchenko написал:
>
> Hello, my friend.
> I'm a Dmitry Shevchenko, former engineer ( rus direct translation - the
> engineer-technologist of electrovacuum manufactu
Can you show any photos of the new chip, not only the whole wafer but the
also a single chip in good resolution?
What factory made the wafers and the chips and what factory put them in the
SOIC capsules?
/Martin
On Tuesday, 10 April 2018 19:38:38 UTC+2, Dmitry Shevchenko wrote:
>
> 4" wafer pr
yep. cheap. cheap. cheap.
Original Message
From: gregeb...@hotmail.com
To: neonixie-l@googlegroups.com
Subject: Re: [neonixie-l] Re: Russians chip K155ID1 SOIC 16L
packaged
Date: Tue, 10 Apr 2018 13:12:44 -0700 (PDT)
>I'm speculating that most packaging houses only offer S
I'm speculating that most packaging houses only offer SMT-style packages.
They are produced by the billions and have lower material costs than DIP
due to smaller size alone. On top of that, leadframes for DIPs are probably
in much shorter supply.
--
You received this message because you are s
>While we are at it, I have this question to ask:
Why on earth would a surface mount version of a K1551D1
even be a consideration, much less a real product?
>
>
> Original Message
>From: gregeb...@hotmail.com
>To: neonixie-l@googlegroups.com
>Subject: RE: [neonixie
Wow! 4-inch wafers. I have not seen one of those since the 1980's.
What process-technology is this on ?
I'd love to hear more about the number of number of masks, and process
steps.
--
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4" wafer produced at begin 2017.
Wafer has been diced (scribed) and assembled at December 2017.
понедельник, 9 апреля 2018 г., 10:20:05 UTC+3 пользователь Dmitry
Shevchenko написал:
>
> Hello, my friend.
> I'm a Dmitry Shevchenko, former engineer ( rus direct translation - the
> engineer-technol
So the die wafers were produced recently, in last year or this year?
/Martin
On Tuesday, 10 April 2018 13:06:26 UTC+2, Dmitry Shevchenko wrote:
>
> *I have a few questions about these ic’s that I hope you can answer: *
> *Which company is manufacturing these ic’s?*
>
> My company
> Details
>
>
*I have a few questions about these ic’s that I hope you can answer: *
*Which company is manufacturing these ic’s?*
My company
Details
LLC "R&D Production Center Microbiotechniques"
ITN (Individual Taxpayer Number): 4004019698
IEC (Industrial Enterprises Classifier): 400401001
PSRN (Primary S
Judging from "datasheet" provided, it is really the same die as in old
chips. It makes me wonder if these weren't created from leftover dies from
old production, just packaged in different housing.
Note that all the bad things about old chips are present here too:
breakdown voltage of >60V, high
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