Hi, I think Tony makes an excellent point. The main purpose of this work is to compress the SRv6 header. I agree with Tony that the w.g. should focus on the solution that provides the best header compression.
Bob > On Sep 16, 2021, at 3:23 PM, Tony Li <[email protected]> wrote: > > > Hi all, > > We now seem headed to be adopting both the requirements and analysis drafts > and thoughts start to turn towards the debate for selection. > > The requirements draft has done a good job documenting our requirements and > the analysis draft gives us a perspective on how the various proposals > fulfill those requirements, but a deeper nuance is needed to guide us to > making an optimal choice. > > To that end, it seems to me that three of the requirements are paramount: > > - Encapsulation Header Size > - Forwarding Efficiency > - State Efficiency > > Of these three, Forwarding Efficiency and State Efficiency seem like they > will be overcome by hardware technology. Continued growth in semiconductors > will help us scale here, so the remaing requirement of the Encapsulation > Header Size would seem to predominate, and we should therefore optimize for > that. > > Regards, > Tony > > _______________________________________________ > spring mailing list > [email protected] > https://www.ietf.org/mailman/listinfo/spring
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_______________________________________________ spring mailing list [email protected] https://www.ietf.org/mailman/listinfo/spring
