dwc3-sti-glue has been broken since MISC uclass has been
modified to scan DT sub-nodes after bind.
Fixing it by a using the no-op uclass.

Signed-off-by: Patrice Chotard <[email protected]>
---

 drivers/usb/host/dwc3-sti-glue.c | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/drivers/usb/host/dwc3-sti-glue.c b/drivers/usb/host/dwc3-sti-glue.c
index c99a1985cca5..99d4e29414aa 100644
--- a/drivers/usb/host/dwc3-sti-glue.c
+++ b/drivers/usb/host/dwc3-sti-glue.c
@@ -239,7 +239,7 @@ static const struct udevice_id sti_dwc3_glue_ids[] = {
 
 U_BOOT_DRIVER(dwc3_sti_glue) = {
        .name = "dwc3_sti_glue",
-       .id = UCLASS_MISC,
+       .id = UCLASS_NOP,
        .of_match = sti_dwc3_glue_ids,
        .ofdata_to_platdata = sti_dwc3_glue_ofdata_to_platdata,
        .probe = sti_dwc3_glue_probe,
-- 
2.17.1

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