> The current imx8mp-dhcom-som.dtsi describes prototype rev.100 SoM, > update the DT to describe production rev.200 SoM which brings the > following changes: > - Fast SoC GPIOs exposed on the SoM edge connector > - Slow GPIOs like component resets moved to I2C GPIO expander > - ADC upgraded from TLA2024 to ADS1015 with conversion interrupt > - EEPROM size increased from 256 B to 4 kiB > Signed-off-by: Marek Vasut <ma...@denx.de> Applied to u-boot-imx, master, thanks !
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