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Today's Topics:
1. Re: Ettus B2x0 enclosure group buy/machining interest?
(Linnenkamp, Nicholas via USRP-users)
2. Re: Which approach to use for adding new components in USRP's
FPGA ? (Matt Ettus via USRP-users)
3. Quality Rubber Duck Antennas? (Jason A. Donenfeld via USRP-users)
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Message: 1
Date: Thu, 24 Apr 2014 22:07:45 +0000
From: "Linnenkamp, Nicholas via USRP-users"
<[email protected]>
To: "[email protected]" <[email protected]>
Subject: Re: [USRP-users] Ettus B2x0 enclosure group buy/machining
interest?
Message-ID:
<f12eb16eed10e34598b8204ce060869c0ceae...@rrc-ats-exmb2.ats.atsinnovate.com>
Content-Type: text/plain; charset="utf-8"
Two additional points.
1. ABS plastics come in anti-static varieties that are not much more
expensive than regular ABS. It even appears that you might be able to print
circuit boards, crappy as they might be.
2. We have used regular PLA (non-conductive) and haven?t seen a problem
but we generally don?t have problems with static discharge where we are.
I?m going to stick with the argument that not having a case for the B210 is
probably a worse scenario than having a plastic case. Although if you
constantly wipe it off with a silk cloth you get what you deserve.
From: Dan CaJacob [mailto:[email protected]]
Sent: Thursday, April 24, 2014 11:52 AM
To: Ian Buckley
Cc: Linnenkamp, Nicholas; [email protected]
Subject: Re: [USRP-users] Ettus B2x0 enclosure group buy/machining interest?
I am not encouraging a plastic case at all, but if you must use it, use
something like this with an antistatic coating:
http://www.mcmaster.com/#static-control-plastic/=rodwj8 It machines well, but
you wouldn't make a 3D case from it. I use it for clear dust covers on
sensitive electronics.
Very Respectfully,
Dan CaJacob
On Thu, Apr 24, 2014 at 11:25 AM, Ian Buckley via USRP-users
<[email protected]<mailto:[email protected]>> wrote:
Nicholas,
A word of caution about home brewed plastic cases. Production plastic cases
that you see wrapped around electronics are generally specifically engineered
to address ESD and EMI issues with coatings and treatments. The handling of
certain types of plastics can produce about as good a source of ESD as it gets,
I once watched an entire set of boards get destroyed at a trade show because
some clever chap had commissioned someone to build them a bunch of transparent
cases to show off the internals?said cases quickly accumulated fingerprints and
were constantly wiped clean again with a cloth?..zap!
-Ian
On Apr 24, 2014, at 5:12 AM, "Linnenkamp, Nicholas via USRP-users"
<[email protected]<mailto:[email protected]>> wrote:
?Also, if you're considering extruded plastic type enclosures you might
consider that such enclosures will provide zero RF shielding, which is one of
the two prime reasons for having an enclosure.?
At the moment the current solution of not having a case also provides zero RF
shielding. I think that the immediate need of keeping some of the SMD parts
from being knocked off the board, accidentally dropping your laptop onto the
B210 and cracking the board, or errant ESD from destroying components takes
precedence over RF shielding.
From: USRP-users
[mailto:usrp-<mailto:usrp->[email protected]<mailto:[email protected]>]
On Behalf Of Marcus D. Leech via USRP-users
Sent: Wednesday, April 23, 2014 6:12 PM
To: [email protected]<mailto:[email protected]>
Subject: Re: [USRP-users] Ettus B2x0 enclosure group buy/machining interest?
On 04/23/2014 05:19 PM, Linnenkamp, Nicholas via USRP-users wrote:
Interesting discussion about a case for the B210.
I have been working on putting together a suitable case for the B210 via 3D
plastic extrusion (Makerbot Replicator 2) and I?m pretty close a solid design.
I have a few prototypes that seem to be doing the trick around our lab. They
don?t take too long to print and I think pretty soon I will try to make them
available online for sale.
The design that I have isn?t fit for outdoor use nor does it have engraving or
labeling. The only bonus is that they would be considerably cheaper and
lighter than a machined case.
As soon as I have them available I will post something here.
Nicholas
From: USRP-users [mailto:[email protected]] On Behalf Of via
USRP-users
Sent: Wednesday, April 23, 2014 4:45 PM
To:
Subject: Re: [USRP-users] Ettus B2x0 enclosure group buy/machining interest?
I'm interested in the enclosure. Even if it's only supplying machined end
plates. Engraving/labeling would be a bonus.
Does anyone in the US stock the Takachi enclosure or is this an import only
option right now?
So, something that people should be aware of is that the B2xx board layout will
change slightly for new units, starting sometime
soon (for a wishy-washy definition of "soon").
That won't affect people for boards they already have, but if someone is
planning on doing a stock-pile of enclosures as a bit of
"free enterprise", be aware that the board/connector layout is likely to
change in the coming weeks.
Also, if you're considering extruded plastic type enclosures you might consider
that such enclosures will provide zero RF shielding, which is one of
the two prime reasons for having an enclosure.
--
Marcus Leech
Principal Investigator
Shirleys Bay Radio Astronomy Consortium
http://www.sbrac.org
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Message: 2
Date: Fri, 25 Apr 2014 13:40:47 +0200
From: Matt Ettus via USRP-users <[email protected]>
To: Anum Sheraz <[email protected]>
Cc: "[email protected]" <[email protected]>
Subject: Re: [USRP-users] Which approach to use for adding new
components in USRP's FPGA ?
Message-ID:
<CAN=1kn96udh+Q5CZudgn2nR+X7CdLhDh+q=zpumurzraaxt...@mail.gmail.com>
Content-Type: text/plain; charset="utf-8"
Anum,
There are a number of factors, the first of which device you have. Verilog
and VHDL will work with all of our devices, but the X300 and X310 are the
only ones which support LabVIEW FPGA. There is info about targeting
Simulink FPGA to the USRP N210 here:
http://www.mathworks.de/de/help/shared_sdr_sdru/examples/fpga-targeting-with-usrp-r-n210-hardware.html
Which you choose will also depend on which environment you are most
comfortable in. If you are used to Verilog or VHDL, go for it. If you are
most competent in LabVIEW FPGA or Simulink, then use them.
Matt
On Fri, Apr 18, 2014 at 7:31 PM, Anum Sheraz via USRP-users <
[email protected]> wrote:
> Hi,
>
> 1. Changing HDL codes directly from source file (verilog).
> 2. Using LABView FPGA for this ?
> 3. Using MATLAB Simulink approach ?
>
> As the default FPGA source code also contains the UHD drivers controllers,
> so
> we wont erase the existing code. for this reason, the (number 1) approach
> can
> be used.
>
> but I was thinking that if i need to add some additional functions to the
> FPGA
> block of USRP. can i use LABView FPGA or SIMULINK (Xilinx System
> Generator) to
> make the design first, convert it into HDL codes, create bit file and
> upload
> its image into the USRP's FPGA. Will that be possible ?
>
>
>
>
> _______________________________________________
> USRP-users mailing list
> [email protected]
> http://lists.ettus.com/mailman/listinfo/usrp-users_lists.ettus.com
>
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Message: 3
Date: Fri, 25 Apr 2014 17:44:16 +0200
From: "Jason A. Donenfeld via USRP-users" <[email protected]>
To: "[email protected]" <[email protected]>
Subject: [USRP-users] Quality Rubber Duck Antennas?
Message-ID:
<cahmme9pdw3jj2ldobggv1di0x9mp+ie4gxahx1asnxwrf3e...@mail.gmail.com>
Content-Type: text/plain; charset="utf-8"
Hey guys,
Where do y'all buy your sma rubber duck antennas? I'm looking for an
inexpensive supplier. I've got plenty of GSM and 2.4ghz ones, but I haven't
been able to find 1090mhz or 87mhz-128mhz rubber duck antennas.
Jason
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