Hello,
I do not know exactly how the Seebeck coefficients are "mixed" within a
alloy.
Silver and copper have near equal coefficients.
Sn should be similar to Pb on the same side of Cu.
On the other side of Cu there are Cd (no longer allowed for ROHS) and Sb
(Antimony) and Ge (Germanium).
So I would go for Sb or Ge doped Tin solders if you do not want to have
100% Ag + Cu
With best regards
Andreas
Am 03.07.2016 um 12:33 schrieb Andrea Baldoni:
Hello.
I repeated the experiment with a better setup, I also added some alloys
that are already arrived. So far, a really "low" EMF solder hasn't been
identified.
Measurements have been done between water ice point and boiling point with
Agilent 34401A.
I don't expect the curves be linear, but here it's assumed they are.
Copper - Sn96.5/Ag3/Cu0.5 -> 3.35uV/K
Copper - Sn95.5/Ag3.8/Cu0.7 -> 3.22uV/K
Copper - Sn60/Pb40 -> 3.34uV/K
Copper - Pb92.5/Sn5/Ag2.5 -> 3.02uV/K
Copper - Brass -> 3.30uV/K
I am waiting for Sn96/Ag4, Sn99/Cu1.
Best regards,
Andrea Baldoni
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