On Sat, 29 Oct 2016 20:41:48 +0200, you wrote: >On Sat, 29 Oct 2016 15:27:49 +0100 >"Dr. David Kirkby (Kirkby Microwave Ltd)" <[email protected]> >wrote: > >> But if one could use copper as the bond wire, rather than gold which is >> quite common, then it would give you very little thermal EMF > >Copper is more and more used for bonding wires. >See: >http://www.ti.com/lit/wp/sszy003/sszy003.pdf >http://link.springer.com/article/10.1007/BF03214983 >https://nepp.nasa.gov/files/26611/2015-370-Rutkowski-Final-Paper-NEPPweb-Copper-Wire-Bonds-TN26444.pdf > >But be aware, that the bond pad on the chip is still aluminium in most cases >I don't know whether there is any process that uses copper bond pads at all. >As far as I know, all of the relevant processes for analog designs (ie those >with node sizes over 130nm) still use aluminium interconnect only. IIRC the >first node size that got copper interconnect was 65nm and about 10 years ago. > >... > > Attila Kinali
Wide copper "straps" replaced gold and aluminum bond wires in high performance power devices more than 10 years ago. I think I first heard about it from IRC (International Rectifier Corporation) for the drain connection in TO-220 power MOSFETs to improve the Rds(on) which was becoming limited by the package. These days it is used with SO-8 and other packages as well. _______________________________________________ volt-nuts mailing list -- [email protected] To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/volt-nuts and follow the instructions there.
