From: David Roberson … my main concern with the induction cooktop is the 
mismatch between the heating coil and the typical shape of the fuel cores.  If 
researchers change the form factor of the fuel into a planar design … then that 
issue can be somewhat resolved. 

 

Dave, one more thing I keep forgetting to bring up… think of the induction 
cooktop as a potential substitute for the ultrasonic transducer. The first 
patent granted on these things talks about ultrasound (GE invented them).

 

If the fuel could be arranged as a nanoporous solid of nickel powder and other 
ingredients, so that internal compression of the core forces cavitation. These 
cooktop operates in the same ultrasound range as sonofusion, even though the 
waves are nominally electromagnetic, rather than phonons. The result can be 
effectively the same.

As for shape - configuring the fuel core as a pancake is possible. This would 
mean that hydrogen release must be more gradual - high pressure is avoided, and 
of course and that means that a moderate temperature not be exceeded. A 
temperature can be chosen which is near the hydrogen release temperature of 
TiH2 – somewhere around 300C after the gain has kicked in. 

 

Look at it this way – there is evidence in the literature that ultrasonic 
cavitation is effective for LENR – as well as the Letts/Cravens magnetic 
effects - and the induction cooktop could be providing both ! This is including 
a strong power level exceeding a kilowatt, which is more intense than most 
piezos. So there could be two advantages to this as a power source – magnetic 
waves combined with ultrasonic cavitation. 

 

There are papers on ultrasound in solids - in the literature, but none which 
include the aspect of LENR. The key could be creating a molded fuel which is a 
nano-porous pancake disk – which is a nominally solid fuel mix, but which is 
ductile enough to allow internal cavitation due to nano-porosity, but with slow 
hydrogen release.

 

This seems possible… but would require a lot of engineering.

 

 

Reply via email to