I use the method (with one change) that is described by Don, W3FPR. I use 0.025 inch diameter solder. I tin the pad that I want to solder, first, with a tiny bit of solder. Holding the iron on the pad so the solder is fluid, I use small tweezers to hold the part on the surface of the pc board and slide it into the solder. Hold very still and remove the iron. After about 5-sec release the tweezers. Then solder the other contacts of the part, coming back after doing that to reheat the original solder point. Often that initial soldering needs a bit of reflow.
I avoid soldering the ground side of any part as the first contact as ground plains typically take more heat to flow solder. Get the part attached and finish soldering the grounds. Use good temperature on grounds to speed the process. Heating the device too long can destroy them. A bit of flux can help the ground soldering. Also one should clean the surface of a new pc board before soldering anything. It can be as easy as using a pencil eraser which will remove surface oils which prevent good heat transvfer. I sometimes use a bit of alcohol with an acid brush to accomplish the same. GL, Ed - KL7UW ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:Elecraft@mailman.qth.net This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html
