From: "hongbo.zhang" <hongbo.zh...@linaro.com>

V2->V3 Changes:

1. Moved the previous "[PATCH V2 2/6] Thermal: make sure cpufreq cooling
register after cpufreq driver" from generic cpu cooling layer to ST-Ericsson
driver, thus only 5 patches in total in V3 patch set.

2. Update ST-Ericsson thermal driver due to review comments from Viresh Kumar
and Francesco Lavra.

hongbo.zhang (5):
  Thermal: add indent for code alignment.
  Thermal: fix bug of counting cpu frequencies.
  Thermal: Remove the cooling_cpufreq_list.
  Thermal: Add ST-Ericsson DB8500 thermal driver.
  Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.

 .../devicetree/bindings/thermal/db8500-thermal.txt |  40 ++
 arch/arm/boot/dts/dbx5x0.dtsi                      |  14 +
 arch/arm/boot/dts/snowball.dts                     |  31 ++
 arch/arm/configs/u8500_defconfig                   |   4 +
 arch/arm/mach-ux500/board-mop500.c                 |  64 +++
 drivers/thermal/Kconfig                            |  20 +
 drivers/thermal/Makefile                           |   2 +
 drivers/thermal/cpu_cooling.c                      | 103 +---
 drivers/thermal/db8500_cpufreq_cooling.c           | 108 +++++
 drivers/thermal/db8500_thermal.c                   | 531 +++++++++++++++++++++
 include/linux/platform_data/db8500_thermal.h       |  38 ++
 11 files changed, 878 insertions(+), 77 deletions(-)
 create mode 100644 Documentation/devicetree/bindings/thermal/db8500-thermal.txt
 create mode 100644 drivers/thermal/db8500_cpufreq_cooling.c
 create mode 100644 drivers/thermal/db8500_thermal.c
 create mode 100644 include/linux/platform_data/db8500_thermal.h

-- 
1.7.11.3

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