Hi Jan, 

No Offense whatsover :)

Regarding your comment I would have to say that the argument presented in
the document you referenced is spurious for the following reasons.

1. The author says they still use elm. ;-)
2. The Author refers to a "Principle of Minimal Munging" (in quotes)
implying that this principle is established in RFC 822 and RFC 1123. They
do not do so.
3. I suspect that the vast majority of posts to this list are meant to go
to the address [EMAIL PROTECTED]
4. There have been more problems with responder's replies coming to list
members twice because the author forget some manual munging chore.
5. Why would you want to reply-all when it is safe to assume that the
person you are replying to (in this case) is a member of
[EMAIL PROTECTED] and will recieve two copies if you did that?
6. This type of situation is exactly one of the reasons why the Reply-To:
header is defined.

In actual truth I would argue that adding a Reply-To: is the Correct way
to implement the needed behavior for two reasons:

1. From: should reference the person that wrote the email.
2. A response in the majority of cases should go to [EMAIL PROTECTED]

Reply-To: enables this behavior. If you decide you wish to reply privately
for whatever good reason, in the exceptional situation you can use manual
field editing to make sure you reply appropriately. This would be more
efficient.

Of course none of this will help Sean or people that use Lotus Notes.

:)
--Brigham Young

--- Jan Schaumann <[EMAIL PROTECTED]> wrote:
> "Mr. Brigham Young" <[EMAIL PROTECTED]> wrote:
> > Hey guys,
> > 
> > I use majordomo at work and I know you can set it up to add a
> > 
> > Reply-To: [EMAIL PROTECTED]
> > 
> > header to the mail when majordomo sends it on to the list subscribers.
> 
> > That way you hit reply and it goes back to majordomo without having to
> > dink with anything and keep using whatever mail client turns your
> crank.
> 
> Oooooh, no good.  Try "reply-to munging considered harmful" on google.
> 
> -Jan



=====
--> Brigham Young
Senior Project Leader CAUSMIS
Senior Technician, MRAM etching
University of Idaho
Office 208.885.5313 
Plasma Lab 208.885.7934 
Minerals Lab 208.885.5308

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