On 01/16/2017 11:26 AM, Brian Walenz wrote: > I've also started reflowing and adding fresh solder before attempting > to desolder. Could be better heat transfer, or just easier to suck > up a larger blob.
On a veneered and generated board like one from a PDP-8, I'd probably use a fusible alloy, such as Chip-Quik and avoid elevated temperatures altogether. --Chuck
