Hi,

> what design rules and how many layers do you plan to use with the Milkymist
> hardware platform? Any special features needed, e.g. plugging, blind via
> or microvias etc?

I am planning to use 6 layers, with 6 mil width and spacing, without special 
features. This is however only a plan, I may change those rules if routing 
turns out to be too difficult.

> Who is going to solder the BGA chip reliable?

I will use a professional service with a proper reflow oven and X-Ray control. 
Do you know some providers?

Best regards,
Sébastien
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