[snip] %> %> 4. I hope the "big name" PC makers EMC engineers are also listening in %> on us (some have also commented). I know they are doing their best in %> better electronic design (e.g. multipoint grounding of the main board %> - something I saw on some new PC's) and I don't think I can personally %> help much in this area. I think we should help them convince their %> bosses it is required to put a higher priority on the long term EMC %> performance (i.e. mechanical packaging design). %> %> thank you all again for your cooperation %> %> moshe valdman %> mgr - EMC, Safety, Reliability and Components Engineering %> Scitex Israel
[snip] I have also noticed that some PC's have massive, multipoint connection of the return plane(s) to the chassis. In fact, it's something that I am thinking of doing in our next product. Has anyone had any experience with this EMC technique? Does anyone know if there are any caveats to watch for or any potential performance problems? BTW, as the culprit, who first brought up the term "big name", I am starting to have some regrets. Actually, all the two-letter/three-letter PC's that I have tested have done quite well--I wasn't thinking of those. I was thinking, instead, of some of the super, high-volume manufacturers and system integrators, etc. I apologize for that confusion, sorry. Max Max Kelson [email protected]
