For hi shock/vibration environs, you must use mechanical attachment
hardware. 

For static ckts, depending on material, I have used cyanoac-based adhesives
w/good short-term (>72hrs) results. The general process is to bend the TC
wire into place, secure w/a bead of adhesive about 3mm away from the
bi-metal contact point, retain placeement of the TC wire w/xfmr tape, push
the TC junction onto the object to be measured, then cover the junction
w/small amount of thermally conductive compound (the white heatsink spooge).

For long-term apps that have many thermal cycles, a higher grade of adhesive
must be used, surfaces must be prepared, and strain relief loops must be
incorporated into the TC wire prior to the junction.

For really diffucult jobs, I would save much time by using strain-gage
adhesive w/film TCs.


-----Original Message-----
From: Joe Finlayson [mailto:jfinlay...@telica.com]

        I am in the process of performing a thermal evaluation and am using
thermocouples to measure surface temperatures of IC's, etc.  I'm finding
that the thermocouple tape that I'm using tends to experience a degradation
of the adhesive as the temperatures increase (in the 80-100°C range) causing
the thermocouples to separate from the surfaces.  I'd appreciate any advice
that could point to a higher performing tape/adhesive for such an
application.  Some of the IC's are quite small which doesn't leave much
surface area for adhesion and I am using as many as 40 thermocouples per
card.


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