Rich:

As always I appreciated your eloquent explanation of the concept of the 
creapage requirement.  Unfortunately experience has taught me long before your 
email.

My question was based on the fact the standard does not SEEM to address the 
larger creapage distance >1000 volts.  My reasoning could only conclude those 
writing the standard concluded the clearance issue would be just as critical as 
creapage >1000 volts.
My recommendations have always ignored the minimum REQUIREMENT in this area 
because my nose recalls too many less then conservative designs burning up. I 
also recall an incident way back when I was wet behind the ears and still 
servicing TV (I saw the first PCB show up in TVs, How old I feel now).  I 
opened the newspaper and saw a home of a customer burned due to the TV.  This 
home was one I had used the vacuum cleaner in their TV every time I visited.  
Apparently I was too successful at my last visit and it was a long time since I 
had been there, no cleaning and I could picture the creapage disaster that 
happened.  I was never absolutely sure of this since I was not a part of the 
post mortem.  

I seem to remember some one saying `All safety standards come from bad 
experiences.'  or something like that.  Right Rich?

As always I enjoyed your detailed understanding.



Best regards,
Terry

>>> Rich Nute <[email protected]> 07/31/01 01:59PM >>>




Hi Terry:


>   I thought the lack of creapage spec. at >1000 V is that the dielectric 
> strength of air would be less then the insulating material and surface 
> accumulated contaminates.  As a result the clearance distance would be the 
> first to break down >1000 Volts.

In general, the electric strength of air is orders
of magnitude less than that of solid insulation.

The distance between conductors on the surface of
an insulator (e.g., a printed wiring board), must
be based on the electric strength of air, not the
solid insulation.  

In some applications, the surface of a solid 
insulation is subject to deposition of an unknown 
foreign matter (referred to in the standards as a
pollution).  Think of this "pollution" as a bread-
crumb trail between the two conductors, that is,
small pieces of matter separated by air.  Consider
the worst-case where the "crumbs" are metallic.
These pieces of metal short out some of the air,
thus redistributing the electric field 
(equipotential lines).  At some point in the
accumulation of foreign matter, the electric field
between two adjacent "crumbs" becomes so great as
to break down the air between the two crumbs.  (An
alternative theory is that the crumbs themselves
dissipate power, glow, and change into a gas.)
This micro-arc (or glowing) has a very high 
temperature, in the thousands of degrees C.  While 
the energy is very small, the thermal energy can 
do microscopic damage to the surface of the solid 
insulation.  For organic insulators, the damaged 
surface degrades to a microscopic carbon dot.  
Carbon, being the stuff resistors are made of, 
contributes to further redistribution of the 
electric field.  And the process continues.

Over a long period of time, a "tree" of carbon
paths will form on the surface of the solid 
insulation.  Eventually, the resistance tree
will connect the two conductors, and a continuous
leakage current will result.  

The resistive path dissipates power in the form
of heat.  This creates still more carbon, reducing 
the value of the resistance, and the leakage 
current goes up.  And the power (and heat) 
disspated in the carbon path goes up.  The process 
continues until a final catastrophic event 
destroys the solid insulation (and, hopefully, 
causes the circuit protection to operate).

According to the researchers, this surface-
insulation failure mechanism is mainly due to the 
working voltage across the insulation.  

(On the other hand, the through-insulation failure 
of solid and air insulation is mainly due to 
overvoltages, not the working voltage.)

The values of distance along the surface of solid
insulation (creepage distance) are based on 
working voltage.  

The values of distance through solid insulation 
and of distance through air insulation are based 
on expected overvoltages.

The values of distance along the surface of solid
insulation are not related to the values of 
distance for air insulation.

As a general rule, the values for creepage 
distance exceed the value for clearance.  When
both are subjected to an overvoltage test, the 
clearance usually will break down rather than
the creepage distance.  However, this is not
the intent of the requirements (because the
clearance distances are minimums and could be
much larger than the creepage distances).

I'm afraid I cannot comment as to why there are
no values for creepage above 1000 V rms.


Best regards,
Rich






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