When fabricating a printed wiring board, if the amount of copper per unit
area differs from one side to anther, undesirable things can happen. One
is, the action of etchant in one area will be less than in another,as
etchant is used up fastest there, than in areas with less copper. This
causes pads and traces whose width varies from place to place on the board.
If you already are using minimum width traces, some may not be able to
carry the design current, or even be etched open. And of course impedance
depends on width and distance from a plane.

Another is, since copper has a different thermal coefficient of expansion
than the substrate, one part of the board will be subjected to a force (as
the copper expands) that another part is not, and the board can actually
warp during soldering. It may cool warped to beyond usable limits.

To prevent these effects, it is common practice to leave copper to steal
etchant away from other parts of the board. It's also common, for boards 
whose outer layers are planes, to add holes in the plane to equalize
chemical and thermal effects much as above. And this scan be a real
annoyance to an EMI engineer! 

Cortland
====================== Original Message Follows ====================

 >> Date:  18-Jan-01 06:20:01  MsgID: 1077-22149  ToID: 72146,373
From:  [email protected] >INTERNET:[email protected]
Subj:  Copper Thieving
Chrg:  $0.00   Imp: Norm   Sens: Std    Receipt: No    Parts: 1

From: [email protected]
Subject: Copper Thieving
List-Post: [email protected]
Date: Thu, 18 Jan 2001 08:15:12 -0600
Reply-To: [email protected]
 

Please excuse my lack of knowledge..........................what is "copper
thieving"?


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