Thanks for the reply, Neil. Actually, as far as components are concerned, I was referring to #5 of the Annex:- "Lead in glass of cathode ray tubes, electronic components and fluorescent tubes". I suppose this means "Lead IN GLASS of....electronic components", rather than "Lead in...electronic components" - that's the clarification I was after. Regards, Dave Neil Helsby <[email protected]> wrote:The Annex states "lead in solders for ......." and does not mention components. If past experience is anything to go by, I would not be surprised to see the implementation date for lead free solder for these purposes to be incorporated before 2006 and neither would I be surprised if the date was July 2006 or very soon after. Preparing now would be better than rushing around at the last minute. Lead (and some other substances) will be exempted for some products and in some restricted quantities, and these are also detailed in the Annex. Regards, Neil Helsby
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