"Feng Li" <[email protected]> wrote on 11/22/02 09:55 AM
> the power and ground of various voltages and characteristics confused me
a lot

I don't see why?  Try some simplified 3D CEM type simulation and view the
surface (or displacement) current patterns and the result of haphazard
violation of the design rules would be understod better.  This is doable
nowadays.  Else go for the old hit or miss method, if it aint broke don't
fix it iterative routine for your layout follow by fabrication and testing,
and soon the reason can be clear.

>  As a common guideline, it is necessary to check for power/ground
> planes or shapes overlapping between adjacent layers in a PCB board?

Yes, the rule is to avoid a situation that cause CM currents (or to put it
in other words: to minimize ground potentials developing) developing from
the lack of symmetry between any of the Power and Ground planes.  This is
especially true when the power plane extends outside the 'shadow' ground
plane.  There are some IEEE EMC Symp papers cir. 1999? on this but off the
cuff I can only recall it is from  some title that had to do with:
Radiation from LCD display panels and PCBs

( Hold back your flaming arrows...)

Older Design Rule: All power and ground plane must be gaped in the same
places.
Now: The 20H rule: The Ground plane must extends beyond the Power plane by
at least 20 X the thickness of the board.
It seems that it work quite well into the hundreds of MHz...

In addition to this, no signal trace must cross a ground gap.   If applied
to a power trace that carries large amounts of charges slushing around,
that is one of the design rules for controlling emission.   If applied to a
sensitive parts of your electronics, it is a countermeasure for immunity
and ESD.

Just my 2ยข worth...
:-)

cheerio


Tim Foo
for the other PCB design rules see:
http://www.geocities.com/timfoo6143/Design_Rules.pdf  OR if the site do not
come on immediately navigate through
http://www.geocities.com/timfoo6143





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