Hi Chris:

The 2nd edition of 61010 has the statement in clause 6.7:

There are no CLEARANCE or CREEPAGE DISTANCE requirements for the interior of
void-free moulded parts, including the inner layers of multi-layer printed
circuit boards.


UL3111 has the following UL deviation from the 1st edition of 61010:

6.7 Eliminate spacing requirements on inner layers of multi-layer printed
circuit boards

The inner layers of a multilayer printed circuit board are considered to be
void-free molded parts. The CLEARANCES and CREEPAGE DISTANCES specified in
Annex D do not apply to these inner layers.  (See Note 2 of Annex D,
subclause D.2.1 of Amendment 1).

Richard

Richard Payne
Tektronix Inc.
Product Safety Engineering
V: (503) 627-1820
F: (503) 627-3838
E: [email protected]







-----Original Message-----
From: Chris Maxwell [mailto:[email protected]]
Sent: Tuesday, August 13, 2002 11:56 AM
To: EMC-PSTC Internet Forum
Subject: Creepage on PCB Internal Layers



Hi all,

I could have sworn that I read somewhere in EN 61010-1 that creepage
distances on internal layers of "void free" PCB boards were reduced from the
normal distances.   For the life of me, I can't find the statement.  

I also seem to remember that there was no hard, fast number given.

So, my question is three fold.

1.  Where is this statement?

2.  Is it true that the creepage is reduced for interal layers (as compared
to surface layers)?

3.  If it is reduced, where do I find a table, or some actual values to use?

As always, the wisdom of the group members is appreciated.

Thanks,

Chris Maxwell | Design Engineer - Optical Division
email [email protected] | dir +1 315 266 5128 | fax +1 315 797 8024

NetTest | 6 Rhoads Drive, Utica, NY 13502 | USA
web www.nettest.com | tel +1 315 797 4449 | 




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