George,

 

I think that as a practical matter, ICT test points are unlikely to cause
EMI/EMC problems, unless there is some egregious cluster of them and their
reference plane antipads disrupt some signal or clock’s return current path. 

 

Via stubs are more of a problem on thick boards than on thin boards.  Hence,
backpanels will show signal integrity problems at lower frequencies than
daughter cards.  Generally speaking, backpanel via stubs could exhibit open
stub resonances in the 5 GHz, or above range.  Daughter cards with thicknesses
in the 62 mils range will show any open stub resonances above 10 GHz.  

 

So, I think you must be operating at high frequencies for the via stub issue
to be a severe one.

 

With a differential pair, maintaining balance is important.  So, placing test
points at approximately the same points on each side of a differential pair is
good practice.

 

Jim Knighten

 

_____________________

James L. Knighten, Ph.D.

Teradata, a division of NCR                 http://www.ncr.com

17095 Via del Campo

San Diego, CA 92127

tel: 858-485-2537

fax: 858-485-3788

 

  _____  

From: [email protected] [mailto:[email protected]] On Behalf Of
George Stults
Sent: Wednesday, June 29, 2005 12:29 PM
To: [email protected]
Subject: ICT test points on clock lines

 

Hi folks,

 

Does anyone have any thoughts (from an EMI/EMC standpoint) for or against
adding ICT test points to traces such as differential pairs, clocks and data
busses?

 

Leaving them off seems preferable, however, assuming they have to be there, my
thoughts would be:

 

1) If the test points are placed close together, they can cut (create slots
in) planes leading to increased emissions

 

2) Test points should be placed symmetrically on a differential pair to
maintain cancellation of fields

 

 

Above what frequency would test points as short stubs start to cause problems
with signal integrity?

 

 

Thanks


George S. 

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