Dear Sudhakar I had a general sense that this test simulated an office environment, simulating roughly the effect that a capacitively charged person touching a table top with IT resting on the table top. I always figured there was a slight EMP effect during the test because I could always see the effect on the video and had a couple of older monitors that were more susceptible to the ESD cycle. One of my monitors quietly checked out (no video) because I let a corner of the cable traverse the Horizontal Plane (my guess). It worked afterwards but thats what I think the test simulates and I hope I’m close because I did a lot of ESDs. My advice is to design from the failure material. I don’t do memory cards but it doesn’t seem logical to test a card itself on an HCP. But then, I don’t know your test set up.
Regards’ Dan Anchondo _____ From: [email protected] [mailto:[email protected]] On Behalf Of [email protected] Sent: Thursday, October 20, 2005 11:05 AM To: [email protected] Subject: Re: ESD test. Hi Sudhakar: I am not an ESD expect, but I had some comments. Are you sure you have to use IEC61000-4-2? I consider this a system test standard, not a component test standard. Take a look at these web pages: All Types of ESD Testing Are Not Created Equal, Part 1 http://www.ce-mag.com/archive/03/03/henry.html All ESD Testing Standards Are Not Created Equal: A Rosetta Stone Analysis http://www.ce-mag.com/archive/03/07/henry.html ESD Association standards http://www.esda.org/standardlistings.html I see discussions of Human Body Model and Machine Model testing, and neither one of those are the same as the IEC61000-4-2 test model. Pat _______Sudhakar Wasnik.wrote___________ > Hello all ESD experts, > >Per IEC 6100-4-2 Sec. 7.1.1 >EUT is isolated from HCP (Horizontal Coupling Plane) by insulating object of 0.5mm thick. > >Standard does not define this Insulating object. Based on the different insulating materials the test results vary. Pass can be fail and fail can be passing. >This is more relevant in memory cards like SD, CF Micro SD etc. > >These cards need to be tested in non operating condition. Just keeping it on the test table separated from the HCP with this IEC insulating object. > >Can some one really throw some light on this insulating object and intent of this test from the standards view? > >Sudhakar Wasnik. >408-542-2928 - ---------------------- ----------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to [email protected] Instructions: http://listserv.ieee.org/listserv/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas [email protected] Mike Cantwell [email protected] For policy questions, send mail to: Jim Bacher: [email protected] David Heald: [email protected] All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc - ---------------------------------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to [email protected] Instructions: http://listserv.ieee.org/listserv/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas [email protected] Mike Cantwell [email protected] For policy questions, send mail to: Jim Bacher: [email protected] David Heald: [email protected] All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc
