Hi Sudhakar: Further to your question, I came across this web page, where the engineer discusses the issues of using the IEC61000-4-2 to test components: http://emcesd.com/tt2004/tt060104.htm
Pat _______Sudhakar Wasnik.wrote___________ > Hello all ESD experts, > >Per IEC 6100-4-2 Sec. 7.1.1 >EUT is isolated from HCP (Horizontal Coupling Plane) by insulating object of 0.5mm thick. > >Standard does not define this Insulating object. Based on the different insulating materials the test results vary. Pass can be fail and fail can be passing. >This is more relevant in memory cards like SD, CF Micro SD etc. > >These cards need to be tested in non operating condition. Just keeping it on the test table separated from the HCP with this IEC insulating object. > >Can some one really throw some light on this insulating object and intent of this test from the standards view? > >Sudhakar Wasnik. >408-542-2928 - ---------------------- ----------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to [email protected] Instructions: http://listserv.ieee.org/listserv/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas [email protected] Mike Cantwell [email protected] For policy questions, send mail to: Jim Bacher: [email protected] David Heald: [email protected] All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc
