We’re still seeing who can plate rhodium. It appears that gold is the low
cost alternative to rhodium not nearly as hard as rhodium but gold is only
$600 an ounce. Rhodium is $5000.
Dave Cuthbert
Linear Technology
_____
From: [email protected] [mailto:[email protected]] On Behalf Of Ron Pickard
Sent: Monday, December 18, 2006 2:43 PM
To: Daniel Roman; Joe Randolph
Cc: [email protected]
Subject: RE: Rhodium PCB
Hi Dan,
Although I’ve never spec’d it in, I believe that “Palladium” or
“Palladium Nickel” plating has been an accepted alternative for years to
the 50uin of gold specified by Part 68 (now EIA/TIA-968 as Joe pointed out).
Trying to filter thru the cobwebs, I think I remember that the
palladium/nickel plating was at least as hard as 50uin of gold and as
unaffected environmentally. I’m not sure how this alternative plating
succeeded.
Comments?
Best regards,
Ron Pickard
[email protected]
_____
From: [email protected] [mailto:[email protected]] On Behalf Of Daniel Roman
Sent: Monday, December 18, 2006 2:22 PM
To: Joe Randolph; Bill Owsley; David Cuthbert; [email protected]
Subject: RE: Rhodium PCB
Some connector vendors have functionally equivalent platings that have gone
through testing. The usually have exotic or trademarked names that escape me
at the moment (they are not overly memorable names).
Dan
_____
From: [email protected] [mailto:[email protected]] On Behalf Of Joe Randolph
Sent: Monday, December 18, 2006 4:01 PM
To: Bill Owsley; David Cuthbert; [email protected]
Subject: Re: Rhodium PCB
On 12/15/2006, Bill Owsley wrote:
Dredging thru the archives of my memory, I recall the 50 um of gold as a
minimum requirement for the RJ - Registered Jack spec from the old Bell labs
for reliability. It might now be enshined in an IPC spec, or still just a
telecom detail.
Hi Bill:
That requirement (for a minimum of 50 micro-inches of gold) used to appear in
FCC Part 68. It now appears in the corresponding industry standard TIA-968.
TIA-968 specifies "hard gold," but also allows room for a "functional
equivalent" in order to allow room for technical innovation. I believe there
is a specified test procedure in TIA TSB 31B for demonstrating the adequacy of
a proposed "functional equivalent." I'm not sure that anyone has actually
succeeded in doing this.
Joe Randolph
Telecom Design Consultant
Randolph Telecom, Inc.
781-721-2848 (USA)
[email protected]
http://www.randolph-telecom.com <http:/
console.mxlogic.com/redir/?arX2rb5Sjqbw
BYS02zI4aDH4OY_fZvBYdTWZXIef8CzCZPtPtj4
ynZmNtqAX0E-l9Q-9DFv_Y01dFEFzDzqabzz0VV
QsCzASy-r1oQAq80mjGx9JkQg1oi6js_3VU3zq9J4SyUed7aar9EVdKPTW>
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