Peter C. Wallace wrote: > [snip] > Yeah, just build up a little corral for the chip with maybe 5 mils or so slop > on each side. (surface tension will bring chip into alignment when the solder > balls melt) liberally flux and apply hot air gun to back of card, no solder > paste needed. I wouldn't _ship_ anything done this way, but its OK for protos. > Also do the BGA(s) first so you can sight underneath the chip to check for > shorts... > Do you do anything special in the layout so that heat transfers well from the other side of the board? Something like adding a small via on each pin or that kind of thing.
I think I may have to make a board with a BGA part on it in the next couple of weeks, so I'm wondering if I should do anything special (so I can avoid the $150/board assembly costs for prototypes). Thanks - Steve ------------------------------------------------------------------------------ Download Intel® Parallel Studio Eval Try the new software tools for yourself. Speed compiling, find bugs proactively, and fine-tune applications for parallel performance. See why Intel Parallel Studio got high marks during beta. http://p.sf.net/sfu/intel-sw-dev _______________________________________________ Emc-users mailing list Emc-users@lists.sourceforge.net https://lists.sourceforge.net/lists/listinfo/emc-users
