Howdy. I just did a zif upgrade on our B&W G3/300 and I noticed that the
stock ZIF has a soft "shim" thingy around the processor with a thin film
covering the processor and the shim. This results in the heatsink settled
nicely onto the CPU and I am assuming that contact is perfect for heat xfer
to the heatsink.

My zif upgrade (G4/450 ZIF from OWC) had nothing like that (no shim, no heat
tranfer medium at all), so ... what do folks use instead? Anyone use thermal
compound? (I already own arctic silver from my peecee tinkerings) Can I even
get a shim like this?  I'd rather leave the stock G3/300 alone because I
will be using it in the future in a ZIFCarrier for a PCI mac.  I am guessing
none of this is necessary for regular use, but I would like to try to
overclock and see if I can squeeze a bit more performance out of this 450.
So, I guess its curiousity more than anything :) And I am wondering why OWC
didn't include this (shim and "tape" to hold it down) in their ZIF package,
but since I ordered this over a year ago I don't know where to find my
customer number to ask them the question (oopsy).

TIA,
Caitlin



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