However,
The IPC-7351 naming convention doesn't seem to adress the issue of changing the pattern name for the soldering process.
Steve Meier
Steve Meier wrote:
Here is an argument to move the Land Pattern naming convention from IPC-SM-782A "Surface Mount Design and Land Pattern Standard" (first published August 1993 last updated in April 1999) to IPC-7351 "Generic Requirements for Surface Mount Design and Land Pattern Standard" (Proposed Standard for Ballot October 2004)
JEDEC has a package they refer to as MO-153 this is sometimes refered to as TSSOP. There exist devices which use this package,
Basically it is a package with gull wing leads on two sides with a pitch between leads of 0.65mm
For the package MO-153AB wich is a 14 pin version of this package there is no defined landpattern in the IPC-SM-782A and thus no Regestered Land Pattern Number. The regestered land pattern number being the prefered way to name the land pattern for this type of package.
The new standard doesn't require package registrataion instead it has a naming convention that allows new packages to be introduced and to have meaningfull names created for the packages land pattern.
For example:
JEDEC JEP95 package type: MO-118AA Package Description: Shrink Small Outline Package (SSOP) 48 Pins IPC-782A Regestered Land Pattern Number: 330A
I think the IPC-7351 name is as follows.
IPC-7351 Name: SSOP63P10-48
IPC-7351 name disected
SSOP
63 0.635mm pitch
10 10.35mm Lead Span (distance from tip of one lead to the tip of the lead on the oposet side of the device)
- seperator before the pin count
48 for the 48 pins
Steve Meier
