>>>>> "Darrell" == Darrell Harmon <[EMAIL PROTECTED]> writes:
> David Kuehling wrote: [..] >> Or is it just a bad idea to connect die-attach-pads directly with >> vias? >> >> David >> > I assume this is an exposed pad type part. Most of these use the > exposed pad either for a good RF ground or heatsink or both. Some I > have used call for a matrix of vias in the pad (one called for 64 15 > mil vias). For hand soldering, I usually do a large hole in the middle > so I can solder the exposed pad and a ring of small vias around the > edge. For reflow, just the matrix of vias with no thermal (not on the > ground plane it connects to either). This somehow seems to violate my manufacturer's design rules. Minimum hole size is .3mm anyways. I always thought that vias absolutely need thermals to connect to planes. How do I connect a via without thermal? Just set the clearance to 0? David -- GnuPG public key: http://user.cs.tu-berlin.de/~dvdkhlng/dk.gpg Fingerprint: B17A DC95 D293 657B 4205 D016 7DEF 5323 C174 7D40 _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
