>>>>> "DJ" == DJ Delorie <[EMAIL PROTECTED]> writes:
>> What Darrell said with emphasis on matrix of vias. I wouldn't use >> just a single via on that part. > The other question, though, is should PCB *allow* you to put thermals > in pads? At the moment, it's not physically possible. If that's impossible, what would be a good workaround? The chip in question is the Freescale MC13201 RF transceiver. It doesn't have other ground pins apart from the large ground pad. Pins are quite dense, so it will be difficult to route a ground-trace in-between two outer pins. There is only one other (digital) pin connected to ground, I could attach that to the paddle, however. Replacing the ground-pad by a polygon wouldn't work either, since polygons cannot be free of solder-resist? Or do I miss something? If I undestand Darrel correctly than attaching the via without thermal is still an option... Thank you all for your comments so far. This is my first PCB layout ever, I would probably be totally lost without the geda mailing list :) David -- GnuPG public key: http://user.cs.tu-berlin.de/~dvdkhlng/dk.gpg Fingerprint: B17A DC95 D293 657B 4205 D016 7DEF 5323 C174 7D40 _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
