On Tue, Jun 17, 2008 at 12:03:10AM -0000, James Johnston wrote: > The particularly problematic issue I was having is a TSSOP footprint that > has a thermal pad to be hooked to GND node. Obviously I want to use a > rectangle for more heat dissipation, but pcb was creating clearance around > it.
At the moment there's no way to set "thermals" for pads. -- Ben Jackson AD7GD <[EMAIL PROTECTED]> http://www.ben.com/ _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
